Optiprint is the ideal partner for miniaturization. A modern machinery guarantee the processing of thinnest materials (as from 12.5µ) in the cutting.
Micro vias which are laser or mechanical drilled can be filled with copper by plated thorugh-hole. Stacked vias and via-in-pad technology are basic requirement in the miniaturization.
Last but not least there are two universal surface finish (ISIG and ENEPIG) available for all assembly techniques. Micro BGA, Flip-Chip, wire bonding, Chip on Flex - and these are only a few keywords.